| Abstract: | Using pyromellitic dianhydride (PMDA) and 4,4’-diaminodiphenyl ether (ODA) as monomer materials, polyimide thin films have been prepared onto glass substrate by vapor deposition polymerization under a vacuum of 2.666×10-3Pa and thermal curing of polyamic acid film in a vacuum at temperature of 150~200 ℃ for 60 min. In this process, the polymerization can be carried out through controlling the stoichiometric ratio, heating time and deposition ratio of the two monomers. The composition, the structure and properties of the polyimide films are investigated with IR spectrum, XRD, and SEM methods. The resultsshow that the polyimide films by vapor deposition polymerization have good electrical properties and thermal stability. Therefore, the vapor deposition polymerization process is considered as a possible method of polymerization for other polymers. |
