| LED的LTCC封装基板研究 |
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| 引用本文： | 薛耀平,王颖麟.LED的LTCC封装基板研究[J].电子工艺技术,2012(4):229-233. |
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| 作者姓名： | 薛耀平 王颖麟 |
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| 作者单位： | 中国电子科技集团公司第二研究所 |
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| 摘 要： | LTCC基板广泛应用于先进的LED封装技术。阐述了LED的陶瓷封装基板的特点,介绍了制造LTCC封装基板的生瓷片性能和制造工艺,通过对LTCC基板热电分离结构的优点分析,指出金属散热通孔是提高LTCC基板散热效果的关键原因,并展望了LTCC封装基板发展方向。
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| 关 键 词： | LED LTCC 生瓷片 基板 封装 |
Study on LTCC Substrates for LED Packaging |
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| XUE Yao-ping,WANG Ying-lin.Study on LTCC Substrates for LED Packaging[J].Electronics Process Technology,2012(4):229-233. |
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| Authors: | XUE Yao-ping WANG Ying-lin |
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| Affiliation: | (No.2 Research Institute of CETC,Taiyuan 030024,China) |
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| Abstract: | LTCC substrate is widely applied in the advanced LED packaging technology.Summarize the characteristics of ceramic packaging technology for LED.The manufacturing processes for Low Temperature Co-fired Ceramics(LTCC) substrate and the characteristics of green tape to manufacture LTCC substrate were introduced.Advantages of LTCC substrate for LED packaging were presented.By discussing several heat-releasing solutions with LTCC technology,the factors of via slug on improving heat-releasing were elaborated.The progresses of LTCC for LED packaging were also pointed. |
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| Keywords: | LED LTCC LTCC Green Tape Substrate Packaging |
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