| Ag颗粒含量对SnCu基复合钎料性能的影响 |
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| 引用本文： | 闫焉服,陈拂晓,朱锦洪,张柯柯.Ag颗粒含量对SnCu基复合钎料性能的影响[J].材料研究学报,2007,21(1):102-106. |
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| 作者姓名： | 闫焉服 陈拂晓 朱锦洪 张柯柯 |
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| 作者单位： | 河南科技大学材料科学与工程学院,洛阳,471003;河南科技大学材料科学与工程学院,洛阳,471003;河南科技大学材料科学与工程学院,洛阳,471003;河南科技大学材料科学与工程学院,洛阳,471003 |
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| 基金项目： | 河南科技大学校科研和教改项目
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洛阳高新先科液压技术有限公司项目 |
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| 摘 要： | 利用颗粒增强原理研制了新型Ag颗粒增强SnCu基复合钎料,研究了Ag颗粒不同含量对复合钎料性能影响.结果表明:当Ag含量(体积分数)为5%时,复合钎料铺展面积最大,润湿角最小,钎焊接头蠕变寿命最长,比基体钎料提高23倍.
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| 关 键 词： | 金属材料 Ag颗粒 蠕变寿命 复合钎料 颗粒增强 |
| 文章编号： | 1005-3093(2007)01-0102-05 |
| 修稿时间： | 11 21 2005 12:00AM |
Effect of content of Ag particles on properties of SnCu based composite solder |
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| YAN Yanfu,CHEN Fuxiao,ZHU Jinhong,ZHANG Keke.Effect of content of Ag particles on properties of SnCu based composite solder[J].Chinese Journal of Materials Research,2007,21(1):102-106. |
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| Authors: | YAN Yanfu CHEN Fuxiao ZHU Jinhong ZHANG Keke |
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| Affiliation: | School of Materials Science and Engineering, Henan University of Science and Technology, Luoyang 471003 |
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| Abstract: | Based particle-enhancement principle, a novel Ag particle-enhancement SnCu based composite solder was formed by adding Ag particles into SnCu solder. The influence of different contents of Ag particles on properties of SnCu based composite solder was investigated. Results indicate that the spreading area of the composite solder with 5% Ag particles is largest, the wetting angle smallest, and its creep rupture life longest, which is 23 times more than one of the matrix solder at the same experimental condition. So 5% is the optimal content of Ag particles among Ag particle -enhancement SnCu based composite solders. metallic materials, Ag particles, creep rupture life, composite solder, particle-enhancement |
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| Keywords: | metallic materials Ag particles creep rupture life composite solder particle-enhancement |
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