A Two-dimensional Stress Analysis of Butt Adhesive Joints Having a Circular Hole Defect in the Adhesive Subjected to External Bending Moments |
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| Authors: | K. Temma T. Sawa H. Uchida Y. Nakano |
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| Affiliation: | a Department of Mechanical Engineering, Kisarazu National College of Technology, Chiba, Japanb Department of Mechanical Engineering, Yamanashi University, Yamanashi, Japanc Department of Mechanical Engineering, Sagami Institute of Technology, Kanagawa, Japan |
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| Abstract: | This paper deals with a two-dimensional stress analysis of butt adhesive joints, with a circular hole defect in the adhesive, subjected to external bending moments. The analysis was done using the two-dimensional theory of elasticity in order to examine the strength of the joints. It was assumed that the adherends were rigid and the adhesive was replaced with a finite strip including a hole defect. The effects of the location and size of a hole defect on the stress distributions around the hole and at the interfaces were obtained by numerical calculations. In addition, the singular stress near the edge of the interface was obtained. For verification, photoelastic experiments were performed. The analytical results were fairly consistent with the experimental results. It was seen that the principal stress around a hole becomes larger with a certain shift toward the free boundary. It was also seen that the stress concentration became larger with an increase of the size of the hole. |
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| Keywords: | Elasticity stress analysis butt adhesive joints bending moment photoelasticity circular hole defect stress singularity |
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