新一代电子组装技术——表面组装技术与多芯片组件技术

２０世纪９０年代初，表面组装技术（ＳＭＴ）已成为世界电子整机组装的主流，现正向窄间距技术、高速、高精度、多功能、免洗焊接和采用无铅焊料发展。微组装技术（ＭＰＴ）则是在半导体ＩＣ技术、混合ＩＣ技术和ＳＭＴ的基础上发展起来的第五代电子组装技术。多芯片组件（ＭＣＭ）是ＭＰＴ的代表产品，ＭＣＭ的关键技术是高密度多层基板技术、叠层芯片技术、芯片互连技术和窄间距技术

A New Generation of Electronic Mounting Technology

To the early 1990's surface mount technology (SMT) became main stream of the electronic equipment assembling technology in the world. Now this technology is developing toward fine pitch, high mount speed, high precision, multifunction, wash free soldering and using leadless solder. Futhermore, micropacking technology (MPT) is the fiveth generation of electronic assembling technology based on semiconductor integration, hybrid integration and SMT. Multichip module (MCM) is the typical product of the MPT.It's key technologies are high density multilayer substrate fabrication, stacked chips and their interconnection technology as well as fine pitch mount.