The Influence of Diphenyl Siloxane on Morphology and Physical Properties in the Poly(Imide Siloxane)(PIS) Copolymer |
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Authors: | Wen-Chang Liaw Kuan-Pin Chen |
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Affiliation: | (1) Department of Chemical Engineering, Nation Yunlin University of Science and Technology, 123, Section 3, University Road, Touliu, Yunlin, 640, Taiwan, Republic of China;(2) Graduate School of Engineering Science and Technology (Doctoral Program), Nation Yunlin University of Science and Technology, 123, Section 3, University Road, Touliu, Yunlin, 640, Taiwan, Republic of China |
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Abstract: | Various numbers of diphenyl-siloxane groups were incorporated in α,ω-bis(aminopropyl)polydimethylsiloxane (APPS) to prepare
α,ω-bis(aminopropyl)-polydimethyldiphenylsiloxane (APPPS) oligomers of three different number-average molecular weights(Mn
= 547,772,1210 g mol−1).These APPPS oligomers were than used, together with 3,3′,4,4′-bezonphenone tetracarboxylic dianhydride (BTDA) and 2-2′-bis4-(3-aminophenoxy)phenyl]
sulfone (m-BAPS), to synthesize a series of APPPS containing poly(imide siloxane) (PIS) copolymers. Microstructural studies
showed that at certain APPPS content, a critical microphase separation point existed, beyond which, microphase separation
began to develop. This critical point of microphase separation was found to be affected by the Mn of the APPPS oligomers (8.0,
4.3 and 2.1 mol% for Mn of 547, 772 and 1,210 g mol−1, respectively). Diphenyl-siloxane significantly improved compatibility between polyimide and polysiloxane segments. Physical
studies showed that the introduction of diphenyl siloxane changed the thermal stabilities and mechanical properties of the
PIS copolymers. These findings have potential applications for design purposes in engineering polymers. |
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Keywords: | polyimide poly(imide siloxane) (PIS) polydimethyldiphenylsiloxane morphology microphase separation |
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