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Effect of electric current pulses on the recrystallization kinetics of copper
Affiliation:1. School of Materials Science and Engineering, Shanghai Jiao Tong University, 1954 Huashan Road, 200030 Shanghai, China;2. Department of Mechanical, Materials and Manufacturing Engineering, University of Nottingham, NG7 2RD Nottingham, UK;3. General Motor China Science Lab, No. 56 Jinwan Road, 201206 Shanghai, China;1. Shanghai Key Laboratory of Digital Manufacture for Thin-Walled Structures, Shanghai Jiao Tong University, Shanghai 200240, PR China;2. State Key Laboratory of Mechanical System and Vibration, Shanghai Jiao Tong University, Shanghai 200240, PR China;3. Department of Mechanical Engineering, Northwestern University, Evanston, IL, USA;1. Associated Engineering Research Center of Mechanics and Mechatronic Equipment, Shandong University, Weihai 264209, China;2. A Key Laboratory of Optoelectronic Materials Chemistry and Physics, Fujian Institute of Research on the Structure of Matter, Chinese Academy of Science, Fuzhou 350002, China;1. Dept. of Industrial Systems and Engineering, The Hong Kong Polytechnic University, PR China;2. Institute of Advanced Materials and Technology, University of Science and Technology of Beijing, China;3. Hefei National Laboratory for Physical Science at Microscale, University of Science and Technology of China, Hefei PR China;1. State Key Laboratory of Solidification Processing, School of Materials Science and Engineering, Northwestern Polytechnical University, Xi’an 710072, PR China;2. Shaanxi Key Laboratory of High-Performance Precision Forming Technology and Equipment, Northwestern Polytechnical University, Xi’an 710072, PR China;1. Université de Lyon, CNRS, France;2. MATEIS, INSA-Lyon, CNRS UMR5510, F-69621, France;3. Department of Materials Engineering, Monash University, Clayton 3800, VIC, Australia
Abstract:
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