大尺寸LED背光源散热结构的仿真、设计与测试

过高的工作温度会直接降低LED使用寿命,并且会影响其发光强度以及发光效率,导致大尺寸LED背光源光学性能大幅下降。从侧边式LED背光源模组的角度出发,设计并采用IcePak软件仿真散热铝挤的宽度和厚度对背光模组温度的影响,最终给出了适用于大尺寸LED背光模组的散热结构。结果表明,随着铝挤的长度或厚度的增加,LED Bar的温度都会减少,取铝挤长度为200 mm,厚度为2 mm,此时LED Bar的温度为69.4℃,小于70℃,符合设计要求且成本最低。进一步测量对应样机的LED Bar温度,其最高温度为69.7℃,与仿真实验结果非常接近。该结构制造工艺较为简单、成本低廉,并且符合背光模组轻薄化的要求,具有一定的市场价值。

Simulation Design and Test of Large-size LED Backlight Heat-dissipation Structure

LED operation life is directly reduced by very high operation temperature and the luminous intensity as well as efficiency are affected, leading to the optical characteristics of large-size LED backlight reduced greatly. From side LED backlight module, lcePak software is designed and used to simulate the influence on backlight module temperature from the width and thickness of heat-dissipation Aluminum substrate. And the heat-dissipation structure suitable to large-size LED backlight module is given. The results show that with the increasing of the length and thickness of Aluminum substrate, the temperature of LED Bar will reduce. When the Aluminum substrate with 200 mm length and 2 mm thickness is chosen, the temperature of LED Bar is 69.4 ℃, which is less than 70 ℃ and the design requirements are met and the lowest cost is got. LED Bar temperature of the prototype is measured and the highest temperature is 69.7 ℃, which is much closed to simulation results. The structure has simple manufacture technology and low cost and accords with the requirements of light weight and thinner backlight module, which has a certain market value.