Mechanical properties of metal and compound films |
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| Affiliation: | 1. Programa de Pós-Graduação em Engenharia e Ciências dos Materiais, Universidade de Caxias do Sul, 95070-560 Caxias do Sul, RS, Brazil;2. Departamento de Física, Pontifícia Universidade Católica do Rio de Janeiro, 22451-900 Rio de Janeiro, RJ, Brazil;3. Programa de Engenharia Metalúrgica e de Materiais, Universidade Federal do Rio de Janeiro, 21945-970 Rio de Janeiro, RJ, Brazil;4. Programa de Engenharia de Nanotecnologia, COPPE, Universidade Federal do Rio de Janeiro, 21941-972 Rio de Janeiro, RJ, Brazil;5. Instituto de Física, Universidade Federal do Rio Grande do Sul, 91501-970 Porto Alegre, RS, Brazil;1. Department of Electronics Technology, Budapest University of Technology and Economics, Budapest, Hungary;2. Department of Microelectronics, Institute of Electron Technology, Krakow, Poland;3. Department of Materials and Semiconductor Structures Research, Institute of Electron Technology, Warsaw, Poland;4. MANA, National Institute for Materials Science (NIMS), Tsukuba, Ibaraki, Japan;1. CCET, Universidade de Caxias do Sul, Caxias do Sul 95070-560, Brazil;2. Departamento de Física, PUC-Rio, Rio de Janeiro 22453-900, Brazil;3. IF, Universidade Federal do Rio Grande do Sul, Porto Alegre 91509-970, Brazil;4. IFGW-DFA, Universidade Estadual de Campinas, Campinas 13083-970, Brazil;5. Plasmar Tecnologia Ltda., Caxias do Sul 95076-420, Brazil |
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| Abstract: | Experimental results on internal stress, Young's modulus and adhesion of metal and compound films are presented and the correlation between these quantities is discussed. Internal stress and Young's modulus were determined by simultaneous in situ measurements during film deposition. In addition to the internal stress values of metal films, which have been given by many workers, we include results on compound films, some of which showed compressive stresses. The Young's moduli of films of such compounds as MgF2 and TiC and of carbon, which have not previously been established, were determined. The strain energy density accumulated in a film during deposition was evaluated from the measured values of Young's modulus and internal stress. In some films, cracks or wrinkles were generated by strain energy, leading to the spontaneous peeling of the films from the substrates. The adhesion experiments were performed using the topple and pull test. The adhesive forces were directly measured and the adhesion energies were estimated. The effect of the substrate temperature and ion bombardment on the adhesion were investigated. The values of adhesion energies were compared with strain energies and the meaning of the adhesion test was considered. |
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