Bulk electromigration by eliminating grain boundary mass flow in continuous aluminum lines |
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| Affiliation: | 1. Department of Microelectronics, Delft University of Technology, 2628 CD, Delft, the Netherlands;2. Department of Mechanical Engineering, P.O. Box 10028, Lamar University, Beaumont, TX 77710, USA;3. Academy for Engineering & Technology, Fudan University, Shanghai 200433, PR China;1. Department of Microelectronics, Delft University of Technology, 2628 CD, Delft, the Netherlands;2. Department of Mechanical Engineering, P.O. Box 10028, Lamar University, Beaumont, TX 77710, USA;3. Academy for Engineering & Technology, Fudan University, Shanghai, 200433, PR China |
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| Abstract: | Starting from electromigration threshold in single segments of narrow large-grained lines, grain boundary mass flow was eliminated in continuous Al lines. Mass flow divergences proceeding from grain boundaries on bonding pads were suppressed by another threshold, which is given by the test current per Al thickness. Narrow test lines should be free of tensile stress, which can produce premature failure. Lifetime tests were performed at 200°C with current densities of 8 × 105 A/cm2. The averaged stripe width was 1.3 μm. Within 16400 hours no failure occurred, due to homogeneous bulk electromigration. |
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