铼基电镀铂工艺研究

以热表面电离质谱计用铼带为基底材料,对比了多种电镀铂体系。结果表明,磷酸盐体系电镀效果最好。分析了各种工艺参数对镀层质量的影响,确定了铼基电镀铂的最佳工艺条件为:H2PtCl6(以Pt计)0.2g/L,(NH4)2HPO440g/L,Na2HPO4140g/L,十二烷基磺酸钠0.01g/L,温度85°C,阴极电流密度4A/dm2,电镀时间20min。适当的真空热处理有助于获得光亮平整、结合力良好的镀层。X射线能谱分析表明,铂镀层厚度可达微米级。

Study on platinum plating process for rhenium substrate

Several platinum electroplating systems were compared with rhenium filament, used for thermal ionization mass spectrometer, as substrate. The resutls showed that phosphate system is the best one. The effects of various process parameters on deposit quality were discussed. The optimal process conditions for platinum plating on rhenium substrate were determined as followes: H_2PtCl_6(according to Pt) 0.2 g/L, (NH_4)_2HPO_4 40 g/L, Na_2HPO4 140 g/L,CH_3(CH_2)_(11)SO_3Na 0.01 g/L, temperature 85 ℃, cathodic current density 4 A/dm~2 and plating time 20 min. Proper vacuum heat treatment helps form bright and smooth deposit with good adhesion. The result of energy dispersive X-ray analysis showed that the deposit thickness can reach micron level.