| 深冷处理后CuCr真空触头材料的组织性能研究 |
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| 引用本文： | 王秀敏,韩会民,丛吉远,王玉魁.深冷处理后CuCr真空触头材料的组织性能研究[J].材料热处理学报,2000,21(4):57-61. |
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| 作者姓名： | 王秀敏 韩会民 丛吉远 王玉魁 |
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| 作者单位： | 大连理工大学材料系,辽宁,大连,116024 |
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| 基金项目： | 国家自然科学基金资助(59777010) |
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| 摘 要： | CuCr50真空触头材料经深冷处理后,抗电弧烧蚀性能明显提高.本文利用电子探针、能谱、显微硬度测试等手段,对CuCr50合金深冷处理前后的显微组织和性能进行了对比分析.结果表明CuCr50合金深冷处理后,显微孔洞明显减少,Cu基体孪晶增多,表面出现弥散分布的细小Cr颗粒.说明在深冷过程中,显微孔洞焊合,致密性增加,Cu基体的纯度增加,电极导热性、导电性随之增加.这种组织与性能的变化使真空开关的抗电弧烧蚀能力及开断能力得到较大改善.
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| 关 键 词： | 深冷处理 铜铬合金触头 显微组织 显微孔洞 电弧烧蚀 |
| 修稿时间： | 1999年10月26 |
Study on Structure and Properties of CuCr Vacuum Contact Material After Cryogenic Treatment |
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| Wang Xiumin,Han Huimin,Cong Jiyuan,Wang Yukui.Study on Structure and Properties of CuCr Vacuum Contact Material After Cryogenic Treatment[J].Transactions of Materials and Heat Treatment,2000,21(4):57-61. |
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| Authors: | Wang Xiumin Han Huimin Cong Jiyuan Wang Yukui |
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| Abstract: | After cryogenic treatment,the resistance property of arc erosion of CuCr50 vacuum contact material change dramatically.In this paper,comparison and analysis have been studied on microstructure and properties of CuCr50 alloy before and after cryogenic treatment by means of electronic probe,energy spectrum and microhardness.The results show that after cryogenic treatment,the small dispersed chromium particles appear on the surface of matrix accompanied by distinct diminution of micropores and increasment of twins in copper matrix.Such changes of structure and properties could greatly improve the resistance ability of arc erosion and the switching ability of vacuum switch. |
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| Keywords: | cryogenic treatment Cu Cr contact material microstructure micropores arc erosion |
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