首页 | 本学科首页   官方微博 | 高级检索  
     

键合时间对粗铝丝超声引线键合强度的影响
引用本文:王福亮,李军辉,韩雷,钟掘.键合时间对粗铝丝超声引线键合强度的影响[J].焊接学报,2006,27(5):47-51.
作者姓名:王福亮  李军辉  韩雷  钟掘
作者单位:中南大学,机电工程学院,长沙,410083
基金项目:国家重点基础研究发展计划(973计划) , 国家自然科学基金 , 中国科学院资助项目
摘    要:试验研究了不同超声功率条件下,键合时间对粗铝丝引线键合强度的影响规律.试验中记录了每种键合试验的键合时间,采集了每一个键合点的剪切测试力作为键合点抗剪强度的表征,记录了每个键合点的状态.结果表明:(1)在小超声功率条件下,键合强度对键合时间敏感;在大超声功率条件下,敏感性下降;(2)短键合时间条件下主要键合失败形式为剥离和无粘接,表明键合界面的原子扩散不够;(3)大超声功率长键合时间条件下的键合失败形式多为根切,表明键合界面的原子扩散虽然足够,但长时间的超声振动也会使粗铝丝产生疲劳断裂,形成过键合.

关 键 词:粗铝丝引线键合  键合强度  键合时间  过键合
文章编号:0253-360X(2006)05-047-05
收稿时间:2005-09-06
修稿时间:2005-09-06

Effect of bonding time on thick aluminum wire wedge bonding strength
WANG Fu-liang,LI Jun-hui,HAN Lei and ZHONG Jue.Effect of bonding time on thick aluminum wire wedge bonding strength[J].Transactions of The China Welding Institution,2006,27(5):47-51.
Authors:WANG Fu-liang  LI Jun-hui  HAN Lei and ZHONG Jue
Affiliation:College of Mechanical and Electronical Engineering, Central South University, Changsha 410083, China,College of Mechanical and Electronical Engineering, Central South University, Changsha 410083, China,College of Mechanical and Electronical Engineering, Central South University, Changsha 410083, China and College of Mechanical and Electronical Engineering, Central South University, Changsha 410083, China
Abstract:The effect of bonding time on the bonding strength of thick aluminum wire wedge bonding was studied under different ultrasonic power conditions. The shear strength is the criterion of bonding strength.The experiments show that:(1) Bonding strength is sensitive to the bonding time when the ultrasonic power is low,and insensitive when the ultrasonic power is high.(2) For short bonding time,the primary failure are peeled off and non-stick,which indicated that the diffusion of interface is insufficient.(3) For long bonding time and large ultrasonic power, the failure state is break,which illuminated that the diffusion of interface is sufficient,and the durative vibration causes fatigue crack in the aluminum wire.
Keywords:thick aluminum wire wedge bonding  bonding strength  bonding time  over bonding
本文献已被 CNKI 维普 万方数据 等数据库收录!
点击此处可从《焊接学报》浏览原始摘要信息
点击此处可从《焊接学报》下载全文
设为首页 | 免责声明 | 关于勤云 | 加入收藏

Copyright©北京勤云科技发展有限公司  京ICP备09084417号