| 凹槽中化学镀铜 |
| |
| 引用本文： | 秦毅红,韦顺文,石西昌,王赛,李竹英. 凹槽中化学镀铜[J]. 腐蚀与防护, 2003, 24(2): 66-69 |
| |
| 作者姓名： | 秦毅红 韦顺文 石西昌 王赛 李竹英 |
| |
| 作者单位： | 中南大学冶金学院,长沙,410083 |
| |
| 摘 要： | 通过平面镀铜和凹槽镀铜试验，讨论了不同工艺条件下镀铜沉积速度和副反应对镀层性质的影响；并对化学镀铜液中各种络合剂和添加剂进行电化学测试分析，选择合适的络合剂和添加剂以及相应的条件，避免凹槽镀铜中空洞可缝隙产生。
|
| 关 键 词： | 凹槽 化学镀铜 工艺条件 沉积速度 络合剂 添加剂 |
| 文章编号： | 1005-748X(2003)02-0066-04 |
| 修稿时间： | 2002-09-05 |
ELECTROLESS COPPER IN TRENCHES |
| |
| QIN Yi-hong,WEI Shun-wen,SHI Xi-chang,WANG Sai,LI Zhu-ying. ELECTROLESS COPPER IN TRENCHES[J]. Corrosion & Protection, 2003, 24(2): 66-69 |
| |
| Authors: | QIN Yi-hong WEI Shun-wen SHI Xi-chang WANG Sai LI Zhu-ying |
| |
| Abstract: | The different complexing agents and surfactants in the solution of electroless copper were tested through comparative blank experiments of electrochemical analysis. The right complexing agents and surfactants were chosen and used to do the research of electroless copper in trenches. The results showed that the complexing agents, surfactants and corresponding process can definitely improve the coverage of electroless copper in trenches. |
| |
| Keywords: | Copper Trenche Electroless |
| 本文献已被 CNKI 维普 万方数据 等数据库收录！ |
