Preparation of Sn-Ag-In ternary solder bumps by electroplating in sequence and reliability |
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| Authors: | Wang Dongliang Yuan Yuan Luo Le |
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| Affiliation: | 1. State Key Laboratory of Transducer Technology, Shanghai Institute of Microsystem and Information Technology,Chinese Academy of Sciences, Shanghai 200050, China;Graduate of University, Chinese Academy of Sciences, Beijing 100049, China
2. State Key Laboratory of Transducer Technology, Shanghai Institute of Microsystem and Information Technology,Chinese Academy of Sciences, Shanghai 200050, China |
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| Abstract: | This paper describes a technique that can obtain ternary Sn-Ag-In solder bumps with fine pitch and homogenous composition distribution.The main feature of this process is that tin-silver and indium are electroplated on copper under bump metallization (UBM) in sequence.After an accurate reflow process,Sn1.8Ag9.4In solder bumps are obtained.It is found that the intermetallic compounds (IMCs) between Sn-Ag-In solder and Cu grow with the reflow time,which results in an increase in Ag concentration in the solder area.So during solidification,more Ag2In nucleates and strengthens the solder. |
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| Keywords: | Sn-Ag-In solder bumps electroplating microstructure shear strength |
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