| 低压断路器脱扣性能的有限元仿真 |
| |
| 引用本文： | 杜凤山,郭振宇,李亮. 低压断路器脱扣性能的有限元仿真[J]. 电子元件与材料, 2004, 23(8): 30-32 |
| |
| 作者姓名： | 杜凤山 郭振宇 李亮 |
| |
| 作者单位： | 燕山大学,河北,秦皇岛,066004 |
| |
| 摘 要： | 为了得到准确的设计参数,笔者采用有限元软件ANSYS电磁–热–结构耦合场分析方法,对热双金属片的热弹性变形进行仿真,通过建立有限元模型,模拟脱扣器驱动部件在各种要求工况下的热–结构特性,分别得到电流为:100 A,120 A,150 A,720 A时,热双金属片温度、位移随通电时间的瞬态关系,避免了数值计算时热双金属片温度偏差引入的误差。
|
| 关 键 词： | 电子技术 热双金属 断路器 有限元 仿真 |
| 文章编号： | 1001-2028(2004)08-0030-03 |
FEM Simulation of the Interruption of Low Voltage Circuit Breaker |
| |
| DU Feng-shan,GUO Zhen-yu,LI Liang. FEM Simulation of the Interruption of Low Voltage Circuit Breaker[J]. Electronic Components & Materials, 2004, 23(8): 30-32 |
| |
| Authors: | DU Feng-shan GUO Zhen-yu LI Liang |
| |
| Abstract: | In order to get the accurate parameters, electromagnetic-thermal-structure FEM was used to simulate the interruption characteristics of the thermal-bimetal in the breaker. The finite element model is built to simulate the driving part in all specified conditions. The thermal-bimetals temperature and displacement is investigated under electric current 100 A, 120 A, 150 A ,720 A. The temperature error is avoided. |
| |
| Keywords: | electronic technology thermal-bimetal circuit breaker finite element simulation |
| 本文献已被 CNKI 维普 万方数据 等数据库收录！ |
|
