High density packaging technology ultra thin package & new tab package |
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Authors: | Osamu Nakagawa Haruo Shimamoto Tetsuya Ueda Kou Shimomura Tsutomu Hata Toru Tachikawa Jiro Fukushima Toshinobu Banjo Isamu Yamamoto |
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Affiliation: | (1) Kita-Itami Works, Assembly Engineering Department, Mitsubishi Electric Corporation, Japan;(2) Kita-Itami Works, Quality Assurance Department, Mitsubishi Electric Corporation, Japan;(3) Fukuoka Works, Semiconductor Equipment Department, Mitsubishi Electric Corporation, Japan;(4) Sagami Works, Mitsubishi Electric Corporation, Japan |
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Abstract: | As electronic devices become more highly integrated, the demand for small, high pin count packages has been increasing. We
have developed two new types of IC packages in response to this demand. One is an ultra thin small outline package (TSOP)
which has been reduced in size from the standard SOP and the other, which uses Tape Automated Bonding (TAB) technology, is
a super thin, high pin count TAB in cap (T.I.C.) package. In this paper, we present these packages and their features along
with the technologies used to improve package reliability and TAB. Thin packages are vulnerable to high humidity exposure,
especially after heat shock.1 The following items were therefore investigated in order to improve humidity resistance: (1)
The molding compound thermal stress, (2) Water absorption into the molding compound and its effect on package cracking during
solder dipping, (3) Chip attach pad area and its affect on package cracking, (4) Adhesion between molding resin and chip attach
pad and its affect on humidity resistance. With the improvements made as a result of these investigations, the reliability
of the new thin packages is similar to that of the standard thicker plastic packages. |
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Keywords: | Mold package SMD (surface mount device) package cracking failure TAB (tape automated bonding) |
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