Interactions of photoresist stripping plasmas with nanoporous organo-silicate ultra low dielectric constant dielectrics |
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Authors: | P Lazzeri GS Oehrlein R McGowan S Pederzoli M Bersani |
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Affiliation: | a ITC-irst, v. Sommarive 18, 38050 Povo, Trento, Italy b University of Maryland, College Park, MD 20742, USA c SEMATECH, Austin, TX 78741, USA d University of Surrey, Ion Beam Centre, Guildford, GU2 7XH, UK |
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Abstract: | To evaluate potential solutions for reducing the damage to ultra low-k dielectrics during photoresist stripping in advanced interconnect technology, we have investigated the mechanisms of interactions between remote H2, D2 and N2 discharges and porous organo-silicate materials. Extended sub-surface modifications take place in high carbon-content organo-silicates, whereas silica-rich dielectrics show negligible chemical damages during the same treatments. The nature of plasma/dielectric interactions depends primarily on the organic fraction of the ULK material. Methyl groups in silica-rich organo-silicates withstand the interaction with the plasma species. Conversely, large organic compounds in carbon-rich dielectrics experience cleavage reactions leading to volatile hydrocarbon formation and compositional changes. For conditions where stripping-induced damage is introduced, the effects scale with the substrate temperature in the range 200 °C-300 °C. The permeation of the ULK material by remote plasma species depends on its porosity. |
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Keywords: | Organo-silicate Dielectric Low-k Stripping Ashing Plasma Damage ToF-SIMS |
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