HEDP溶液钢铁基体镀铜工艺的研究

采用赫尔槽试验和直流电解方法研究了HEDP镀液在钢铁基体上预镀铜的工艺过程,给出了最优镀液组成和最佳工艺条件:Cu2+10g/L,HEDP 160g/L,K2CO 360g/L,pH9.0,温度50°C,通气搅拌,阴极电流密度2A/dm2。试验结果表明,上述HEDP镀液组成简单、容易维护,不加任何添加剂的平均分散能力为62.21%,深镀能力为100%;可操作的阴极电流密度范围较宽,阴极电流密度为2A/dm2时的镀速达0.37μm/min;得到的半光亮铜镀层结合力良好、结晶细致。

Study on process of copper electroplating on steel matrix in solution of Cu-HEDP

The process of strike copper electroplating on steel matrix was studied using HEDP as complexing agent by Hull cell test and direct current electrolysis. The optimal bath composition and operating conditions are as follows: Cu~(2+) 10 g/L, HEDP 160 g/L, K_2CO_3 60 g/L, pH 9.0, temperature 50 ℃, air agitation and cathodic current density 2 A/dm~2. The test results showed that the above-mentioned HEDP bath has the advantages of simple composition and easy in maintenance, with throwing power up to 62.21% and covering power 100% without any additives. The range of cathodic current density is wide and the deposition rate reaches 0.37 μm/min at a cathodic current density of 2 A/dm~2. The obtained semi-bright copper deposit is fine-grained and has good adhesion to steel matrix.