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PECVD生长氮化硅介质膜的工艺研究
引用本文:张顾万,龙飞. PECVD生长氮化硅介质膜的工艺研究[J]. 半导体光电, 2001, 22(3): 201-203,217
作者姓名:张顾万  龙飞
作者单位:重庆光电技术研究所,
摘    要:对PECVD生长氮化硅介质膜的工艺条件进行了实验研究,获得了生长氮化硅介质膜的最佳工艺条件,制出了高质量的氮化硅介质膜,对样品进行了湿法腐蚀和超声实验,在显微镜下观察无膜脱落现象发生。阐述了几种工艺参数对介质膜生长的影响。

关 键 词:PECVD 氮化硅 薄膜 介质膜
文章编号:1001-5868(2001)03-0201-03

Research on Technology for Si3N4 Thin Film Grown by PECVDc
ZHANG Gu-wan,LONG Fei. Research on Technology for Si3N4 Thin Film Grown by PECVDc[J]. Semiconductor Optoelectronics, 2001, 22(3): 201-203,217
Authors:ZHANG Gu-wan  LONG Fei
Abstract:Research on growth technology for Si 3N 4 thin film by PECVD is carried out experimentally.Optimum process condition is obtained,and high quality Si 3N 4 thin film is successfully developed. Through wet etching and ultrasonic experiment ,no film falling is observed with microscope.Effect of some process parameters on the growth of the film is described.
Keywords:PECVD  Si 3N 4  thin film
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