| 基于乙醛酸作还原剂的新型化学镀铜工艺研究 |
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| 引用本文： | 刘韧,李德良,杨振兴.基于乙醛酸作还原剂的新型化学镀铜工艺研究[J].精细化工中间体,2009,39(3):68-72. |
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| 作者姓名： | 刘韧 李德良 杨振兴 |
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| 作者单位： | 中南林业科技大学,资源与环境学院,湖南,长沙,410004 |
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| 基金项目： | 湖南省环境科学学科建设资助项目 |
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| 摘 要： | 研究了乙醛酸化学镀铜体系中各因素对镀速和溶液稳定性的影响，根据实验确定了适宜的化学镀铜液的配方及工艺规范。优化工艺条件：硫酸铜16g／L，乙二胺四乙酸二钠30g/L，乙醛酸13g／L，2，2’-联吡啶10mg／L，pH12．5，温度40％。优化条件下，可获得结合力良好、表面均匀光亮的镀层，工艺中不使用甲醛，无污染，具有良好的环境效应及社会效应，应用前景广阔。
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| 关 键 词： | 乙醛酸 镀速 化学镀铜 |
Research on Electroless Copper Plating Process Using Glyoxylic Acid as Reducing Agent |
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| LIU Ren,LI De-liang,YANG Zhen-xing.Research on Electroless Copper Plating Process Using Glyoxylic Acid as Reducing Agent[J].Fine Chemical Intermediates,2009,39(3):68-72. |
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| Authors: | LIU Ren LI De-liang YANG Zhen-xing |
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| Affiliation: | School of Resource and Environment;CSUFT;Changsha 410004;China |
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| Abstract: | Factors affecting on plating rate and solution stability were studied for glyoxylic acid reduced electroless copper plating system.A proper composition of the plating solution was obtained as follows:copper sulfate 16g/L,EDTA.2Na 30g/L,glyoxylic acid 13g/L,2,2'-bipyridine 10mg/L.The optimal pH and temperature were 12.5℃ and 40℃,respectively.The process is environmentally benign with no formaldehyde. |
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| Keywords: | glyoxylic acid deposition rate electroless copper plating |
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