| 微量元素对焊料特性的影响 |
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| 引用本文： | 李元山,雷晓娟,陈振华.微量元素对焊料特性的影响[J].电子工艺技术,2006,27(6):326-328,332. |
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| 作者姓名： | 李元山 雷晓娟 陈振华 |
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| 作者单位： | 国防科技大学,湖南,长沙,410073;湖南大学,湖南,长沙,410082 |
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| 摘 要： | 在Sn-20Bi焊料中添加微量Ag、In、Ga和Sb,观察焊料的熔化特性和显微组织的变化.结果表明当Ag的质量分数为0.7%、In为0.1%、Ga为0.5%时焊料的熔点都分别有所降低,Bi的偏析明显减小;Sb不宜作为单独的第三组元加入,但与Ag、In、Ga一起加入时Sb能起到很好的固溶强化且有抑制Sn的相变的作用.通过最佳配比制成的Sn-Bi-X焊料,其熔点与Sn-37Pb接近,而且已不存在Bi的偏析,接近于实用.
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| 关 键 词： | Sn-Bi 无铅焊料 偏析 微观结构 固溶强化 |
| 文章编号： | 1001-3474（2006）06-0326-04 |
| 收稿时间： | 2006-09-29 |
| 修稿时间： | 2006-09-29 |
Influence of Microelements on Properties of Sn -20Bi Solder |
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| LI Yuan-shan,LEI Xiao-juan,CHEN Zhen-hua.Influence of Microelements on Properties of Sn -20Bi Solder[J].Electronics Process Technology,2006,27(6):326-328,332. |
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| Authors: | LI Yuan-shan LEI Xiao-juan CHEN Zhen-hua |
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| Affiliation: | 1. National University of Defense Technology, Changsha 410073, China; 2. Hunan University, Changsha 410082, China |
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| Abstract: | Adding microelements Ag,In,Ga and Sb into Sn-20Bi solder,the change of melting properties and microstructures of the solder were observed.The experiment result showed that when the content of Ag was 0.7%,In was 0.1% or Ga was 0.5% the melting points of the solder reduced respectively and the segregation of Bi obviously decreased.Sb was not suitable added solely but when it was added together with Ag,In and Ga,it can produce a good effect on reinforcement of solid solution,furthermore it can restrain the phase change of Sn.The Sn-Bi-X solder with the best compositions of Ag,In,Ga and Sb has a near melting point to Sn-37Pb.The solder is close to practicality without segregation of Bi. |
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| Keywords: | Sn-Bi |
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