| 电子元件焊点检测技术 |
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| 引用本文： | 胥路平.电子元件焊点检测技术[J].电子测试,2012(4):14-18. |
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| 作者姓名： | 胥路平 |
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| 作者单位： | 中国工程物理研究院电子工程研究所,四川绵阳,621900 |
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| 摘 要： | 焊点在电子产品中具有重要的作用，焊点质量的好坏紧密关系到产品的使用性能和可靠性，而电子元件焊点检测则是保证电子产品出厂质量的关键环节，电子元件焊点检测技术是保障电子产品质量与可靠性的关键技术。针对电子元件焊点检测技术，本文探讨了传统检测方法的缺点和局限陛，介绍了现代检测技术——自动光学检测和自动x射线检测技术，深入分析了自动光学检测和自动x射线检测中的关键技术——图像处理，详细阐述了用于检测的图像预处理和缺陷检测技术。
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| 关 键 词： | 多传感器 数据融合 数理统计 拉托力预报 |
Electronic component solder joint inspection technologies |
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| Xu Luping.Electronic component solder joint inspection technologies[J].Electronic Test,2012(4):14-18. |
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| Authors: | Xu Luping |
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| Affiliation: | Xu Luping(Institute of Electronic Engineering,China Academy of Engineering Physics,Sichuan,Mianyang 621900) |
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| Abstract: | Solder joint plays an important role in electronic products and it’s quality is close related to electronic products’ performance and reliability.Electronic component solder joint inspection ensures the quality of electronic products and the inspection technology is key technology.Aiming the inspection technology,this paper discussed the shortcoming and limitation of traditional detection methods,introduced modern technology— automatic optical inspection and automatic X-ray inspection and researched image processing as technology in both,then,elaborated the pre-processing and defect detection for inspection images. |
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| Keywords: | solder joint inspection automatic optical inspection automatic X-ray inspection image processing |
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