| 国内纸基覆铜箔板用热固性酚醛树脂的发展 |
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| 引用本文： | 祝大同. 国内纸基覆铜箔板用热固性酚醛树脂的发展[J]. 热固性树脂, 2000, 15(1): 41-46,55 |
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| 作者姓名： | 祝大同 |
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| 作者单位： | 北京绝缘材料厂,北京,100054 |
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| 摘 要： | 本文对热固性酚醛树脂在我国纸基覆铜箔板制造中的应用作一综述。并对桐油改性酚醛树脂在此领域中的技术发展作一探讨。
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| 关 键 词： | 覆铜箔板 酚醛树脂 发展 |
DEVELOPMENT OF THERMOSETTING PHENOLIC RESIN USED IN COPPER CLAD LAMINATE BASED ON PAPER IN CHINA |
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| Zhu Datong. DEVELOPMENT OF THERMOSETTING PHENOLIC RESIN USED IN COPPER CLAD LAMINATE BASED ON PAPER IN CHINA[J]. Thermosetting Resin, 2000, 15(1): 41-46,55 |
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| Authors: | Zhu Datong |
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| Affiliation: | Zhu Datong;(Beijing Insulating Material Work, Beijing,10054) |
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| Abstract: | In this paper the application of thermosetting phenolic resin in copper clad laminate based on paper in China was introduced and the development of phenolic resin modified by tung oil in this field was also discussed. |
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| Keywords: | Copper clad laminate Phenolic resin Modified by tung oil. |
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