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基于PDMS的芯片电极多层互连系统的研究
引用本文:芮岳峰,刘景全,杨春生,何庆,李以贵. 基于PDMS的芯片电极多层互连系统的研究[J]. 真空, 2011, 48(2)
作者姓名:芮岳峰  刘景全  杨春生  何庆  李以贵
作者单位:上海交通大学微纳科学技术研究院,微米/纳米加工技术国家级重点实验室,薄膜与微细技术教育部重点实验室,上海,200240
基金项目:航空科学基金(2008ZE57019); 国家自然科学基金(60876082); 上海市科委纳米专项(0852nm06600); 上海市教委曙光计划(08SG13)
摘    要:本文提出了一种基于PDMS(聚二甲基硅氧烷)基底的芯片电极多层互连方法,应用MEMS(微电子机械系统)技术将芯片和电极进行了芯片级的互连,系统集成度高,尺寸小。相比传统的单层互连方法,在相同面积上互连电极数多。并且使用PDMS作为基底材料,大大降低了传统的以硅为基底的加工成本。制备的芯片电极多层互连系统芯片和电极互连数量多,各层绝缘层为绝缘性能良好的柔性Parylene(聚对亚苯基二甲基)薄膜,为柔性多层高密度线路互连技术提供了一种新方法。

关 键 词:植入式  parylene  MEMS  互连  PDMS  

Research on PDMS-based multi-layer interconnection system for chip and electrodes
RUI Yue-feng,LIU Jing-quan,YANG Chun-sheng,HE Qing,LI Yi-gui. Research on PDMS-based multi-layer interconnection system for chip and electrodes[J]. Vacuum(China), 2011, 48(2)
Authors:RUI Yue-feng  LIU Jing-quan  YANG Chun-sheng  HE Qing  LI Yi-gui
Affiliation:RUI Yue-feng,LIU Jing-quan,YANG Chun-sheng,HE Qing,LI Yi-gui(National Key Laboratory of Nano/Micro Fabrication Technology,Key Laboratory for Thin Film and Microfabrication of Minstry of Education,Institute of Mico and Nano science and Technology,Shanghai Jiaotong University,Shanghai 200240,China)
Abstract:A multi-layer interconnection system between chip and electrodes was proposed based on the PDMS as substrate.Then,the MEMS(micro-electro mechanial system) technology was applied to the interconnection between chip and electrodes at chip-level so as to make the system integrity higher with small size.Compared to the conventional single-layer interconnection system,the number of electrodes interconnected to a chip was increased in the same surface area.Moreover,the PDMS used as substrate could greatly reduce ...
Keywords:implantation  parylene  MEMS  interconnection  PDMS  
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