| 面向芯片封装的新型高速高精度平面定位机构研究 |
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| 引用本文： | 刘延杰,孙立宁,孟庆鑫,祝宇虹,刘新宇.面向芯片封装的新型高速高精度平面定位机构研究[J].工具技术,2005,39(5):19-22. |
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| 作者姓名： | 刘延杰 孙立宁 孟庆鑫 祝宇虹 刘新宇 |
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| 作者单位： | 哈尔滨工程大学;哈尔滨工业大学;哈尔滨工业大学;哈尔滨工程大学 |
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| 基金项目： | 国家“863”计划项目(项目编号:2003AA404060)，上海市重点学科资助项目(项目编号:SU/ME02) |
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| 摘 要： | 面向芯片封装领域对高速高精度平台的需求,提出一种新型平面并联定位机构。基于复数向量表示法,建立了机构的运动学模型;结合固定界面子结构模态综合法与有限单元法,考虑连杆柔性和关节柔性,对机构建立了弹性动力学模型;通过仿真与实验的对比分析,验证了这种动力学分析方法的有效性。
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| 关 键 词： | 平面机构 运动学 弹性动力学 |
New High Speed and High Precision Planar Positioning Mechanism for Chip Packaging |
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| Liu Yanjie Sun Lining Meng Qingxin et al.New High Speed and High Precision Planar Positioning Mechanism for Chip Packaging[J].Tool Engineering(The Magazine for Cutting & Measuring Engineering),2005,39(5):19-22. |
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| Authors: | Liu Yanjie Sun Lining Meng Qingxin |
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| Affiliation: | Liu Yanjie Sun Lining Meng Qingxin et al |
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| Abstract: | A new planar parallel positioning mechanism is presented, which can be used as the high-speed and high-precision table in the chip-packaging application. The kinematic model is first studied using the vector theory. Then by combining the fixed-interface mode synthesis of substructure coupling with finite element analysis, the kineto-elastodynamic model is built in consideration of the flexibility of the links and the joints. The simulations and the experiments are conducted, and the results validate the dynamic analysis method. |
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| Keywords: | planar mechanism kinematics Kineto-Elastodynamics |
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