| 真空电子器件高频钎焊设备的研制 |
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| 引用本文： | 陈琦璇,陈大明. 真空电子器件高频钎焊设备的研制[J]. 真空电子技术, 2001, 0(6): 40-42 |
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| 作者姓名： | 陈琦璇 陈大明 |
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| 作者单位： | 北京真空电子技术研究所, |
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| 摘 要： | 介绍了用于真空电子器件封接的高频钎焊设备的结构及设计难点，该设备可方便更换感应线圈以焊接不同规格尺寸的零部件。
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| 关 键 词： | 钎焊设备 感应线圈 真空电子器件 |
| 文章编号： | 1002-8935(2001)06-0040-03 |
| 修稿时间： | 2001-09-18 |
Development of High-frequency Brazing Equipment Used in Vacuum Electronic Devices |
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| CHEN Qi xuan,CHEN Da ming. Development of High-frequency Brazing Equipment Used in Vacuum Electronic Devices[J]. Vacuum Electronics, 2001, 0(6): 40-42 |
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| Authors: | CHEN Qi xuan CHEN Da ming |
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| Abstract: | This paper introduces the structure and design considerations of a high frequency brazing equipment used in sealing of vacuum electronic devices and difficulties in design,It is shown that by exchange inductive coils this equipment can conveniently to seal different sizes of component part. |
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| Keywords: | High frequency Brazing Induction coil |
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