| 微电子封装与设备 |
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| 引用本文： | 高尚通. 微电子封装与设备[J]. 电子与封装, 2002, 2(6): 1-5 |
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| 作者姓名： | 高尚通 |
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| 作者单位： | 河北半导体研究所,河北,石家庄,050051 |
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| 摘 要： | 本文介绍了目前国际微电子封装的发展趋势,阐述了我国微电子封装发展的特点,说明了发展微电子封装设备的必要性,并提出发展我国徽电子封装设备的几点建议。
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| 关 键 词： | 微电子封装 封装设备 发展趋势 |
| 修稿时间： | 2002-06-20 |
Microelectronics Packaging and Equipment |
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| GAO Shang-tong. Microelectronics Packaging and Equipment[J]. Electronics & Packaging, 2002, 2(6): 1-5 |
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| Authors: | GAO Shang-tong |
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| Abstract: | This paper descbibes the trend of microelectronics packaging in the world and the character- istics of microelectronics packaging in China.It states the necessity of developing the microelectronics packaging equipments.Some suggestions on promoting mieroelectronics packaging equipments are giv- en. |
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| Keywords: | Microelectronics Packaging Packaging Equipments Developing Trends |
| 本文献已被 CNKI 万方数据 等数据库收录！ |
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