| 各向异性导电胶用新型导电复合粒子的制备 |
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| 引用本文： | 雷芝红,贺英,高利聪.各向异性导电胶用新型导电复合粒子的制备[J].化工新型材料,2006,34(11):60-63. |
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| 作者姓名： | 雷芝红 贺英 高利聪 |
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| 作者单位： | 上海大学材料科学与工程学院高分子材料系,上海,201800 |
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| 摘 要： | 采用无钯活化的化学镀的方法成功地制备出外镀银/铜/环氧树脂新型导电复合粒子,并对导电复合粒子进行了光学显微镜、SEM和EDS分析.结果表明:制备的导电微粒密度小,具有良好的导电性能,可以满足各向异性导电胶应用需求.
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| 关 键 词： | 各向异性导电胶 导电复合粒子 化学镀铜 化学镀银 |
| 修稿时间： | 2006年7月6日 |
Preparation of a novel conductive composite particle for anisotropic conductive adhesive |
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| Lei Zhihong,He Ying,Gao Lichong.Preparation of a novel conductive composite particle for anisotropic conductive adhesive[J].New Chemical Materials,2006,34(11):60-63. |
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| Authors: | Lei Zhihong He Ying Gao Lichong |
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| Abstract: | This paper presented that a novel conductive particle was prepared by no-palladium electroless plating on epoxy resin powder for anisotropic conductive adhesive.The appearances and cladding material of the conductive composite particle were observed by optical microscope,scanning electronic microscope and energy dispersive spectrometer.The results showed that conductive composite particle has a low density and good conductive performance,which can meet the demand of conductive adhesives. |
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| Keywords: | anisotropic conductive adhesive conductive composite particle electroless copper plating electroless silver plating |
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