Multi-objective thermal design optimization and comparative analysis of electronics cooling technologies |
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| Authors: | Sidy Ndao Yoav Peles Michael K. Jensen |
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| Affiliation: | 1. Department of Mechanical, Aerospace, and Nuclear Engineering, Rensselaer Polytechnic Institute, Troy, NY 12180, United States;2. Dielectric Systems Module, Applied Materials, Santa Clara, CA 95054, United States;3. Department of Mechanical and Aerospace Engineering, University of Central Florida, Orlando, FL 32816, United States;1. Department of Mechanical Engineering, State University of New York at Binghamton, Binghamton, NY, USA;2. Department of Mechanical Engineering and Mechanics, Drexel University, Philadelphia, PA, USA;3. Department of Mechanical Engineering, Indian Institute of Technology, Madras, India;1. Department of Mechanical and Process Engineering, ETH Zurich, 8092 Zurich, Switzerland;2. Advanced Micro Integration, IBM Research–Zurich, 8803 Rüeschlikon, Switzerland |
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| Abstract: | A multi-objective thermal design optimization and comparative study of electronics cooling technologies is presented. The cooling technologies considered are: continuous parallel micro-channel heat sinks, in-line and staggered circular pin-fin heat sinks, offset strip fin heat sinks, and single and multiple submerged impinging jet(s). Using water and HFE-7000 as coolants, Matlab’s multi-objective genetic algorithm functions were utilized to determine the optimal thermal design of each technology based on the total thermal resistance and pumping power consumption under constant pressure drop and heat source base area of 100 mm2. Plots of the Pareto front indicate a trade-off between the total thermal resistance and pumping power consumption. In general, the offset strip fin heat sink outperforms the other cooling technologies. |
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