Micro thermoelectric cooler: Planar multistage |
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| Authors: | GS Hwang AJ Gross H Kim SW Lee N Ghafouri BL Huang C Lawrence C Uher K Najafi M Kaviany |
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| Affiliation: | 1. Department of Mechanical Engineering, University of Michigan, Ann Arbor, MI 48109, USA;2. Department of Electrical Engineering and Computer Science, University of Michigan, Ann Arbor, MI 48109, USA;3. Department of Physics, University of Michigan, Ann Arbor, MI 48109, USA;1. Birck Nanotechnology Center, Department of Electrical and Computer Engineering, Purdue University, West Lafayette, IN 47907, USA;2. Department of Mechanical and Materials Engineering, Portland State University, Portland, OR, USA;1. School of Mathematics and Physics, North China Electric Power University, Beijing 102206, China;2. School of Energy and Environment, City University of Hong Kong, Tat Chee Avenue, Kowloon, Hong Kong Special Administrative Region;3. State Key Laboratory of Alternate Electrical Power System with Renewable Energy Sources, North China Electric Power University, Beijing 102206, China;4. Beijing Key Laboratory of Multiphase Flow and Heat Transfer for Low Grade Energy, North China Electric Power University, Beijing 102206, China;1. Centre for Sustainable Energy Technologies, University of Hull, HU6 7RX, UK;2. Department of Power Engineering, North China Electric Power University, China;1. School of Mechanical Engineering, University of Science and Technology Beijing, Beijing 100083, China;2. State Key Laboratory of Alternate Electrical Power System with Renewable Energy Sources, North China Electric Power University, Beijing 102206, China;3. Beijing Key Laboratory of Multiphase Flow and Heat Transfer for Low Grade Energy, North China Electric Power University, Beijing 102206, China |
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| Abstract: | A suspended, planar multistage micro thermoelectric (TE) cooler is designed using thermal network model to cool MEMS devices. Though the planar (two-dimensional) design is compatible with MEMS fabrication, its cooling performance is reduced compared to that of a pyramid (three-dimensional) design, due to a mechanically indispensable thin dielectric substrate (SiO2) and technical limit on TE film thickness. We optimize the planar, six-stage TE cooler for maximum cooling, and predict ΔTmax = 51 K with power consumption of 68 mW using undoped, patterned 4–10 μm thick co-evaporated Bi2Te3 and Sb2Te3 films. Improvement steps of the planar design for achieving cooling performance of the ideal pyramid design are discussed. The predicted performance of a fabricated prototype is compared with experimental results with good agreements. |
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