Modeling and testing of an advanced compact two-phase cooler for electronics cooling |
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| Authors: | Mark Aaron Chan Christopher R Yap Kim Choon Ng |
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| Affiliation: | 1. College of Pipeline and Civil Engineering, China University of Petroleum, 266580, Qingdao, Shandong Province, China;1. Division of Advanced Nuclear Engineering, POSTECH, Pohang37673, South Korea;2. Mechanical Engineering, POSTECH, Pohang37673, South Korea;3. Korea Atomic Energy Research Institute, Daejeon34057, South Korea;4. Department of Precision Mechanical Engineering, Kyungpook National University, Sangju37224, South Korea |
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| Abstract: | This paper describes the modeling, design, and testing of a high flux and yet compact two-phase CPU cooler, with excellent attributes of low thermal resistance that are derived from the intrinsic design features of phase change phenomena and minimal vapor pressure drop of the device. For the same footprint of a conventional cooler, the prototype rejects more than twice the capacity of CPUs of today. The unique design minimizes its overall size and yet provides adequate area for forced convection cooling. Testing was conducted over an assorted heat loads and air flow rates flowing through the fins, achieving a best performance of 0.206 K/W of device thermal resistance at a rating of 203 W under an air flow rate of 0.98 m3/min. The prototype device is orientation free where a 90° tilt could perform at the same rating conditions. |
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