Comparison of thermal performances of plate-fin and pin-fin heat sinks subject to an impinging flow |
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Authors: | Dong-Kwon Kim Sung Jin Kim Jin-Kwon Bae |
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Affiliation: | 1. School of Reliability and Systems Engineering, Beihang University, Beijing 100191, China;2. Research Institute of Physical and Chemical Engineering of Nuclear Industry, Tianjin 300180, China;1. School of Mechanical, Aerospace, and Systems Engineering, Korea Advanced Institute of Science and Technology, 291 Daehak-ro, Daejeon 305-701, Republic of Korea;1. Korea Institute of Machinery and Materials, 156 Gajeongbuk-ro, Yuseong-gu, Daejeon 34103, Republic of Korea;2. Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology, 291 Daehak-ro, Yuseong-gu, Daejeon 34141, Republic of Korea |
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Abstract: | In this paper, we compare thermal performances of two types of heat sinks commonly used in the electronic equipment industry: plate-fin and pin-fin heat sinks. In particular, heat sinks subject to an impinging flow are considered. For comparison of the heat sinks, experimental investigations are performed for various flow rates and channel widths. From experimental data, we suggest a model based on the volume averaging approach for predicting the pressure drop and the thermal resistance. By using the model, thermal resistances of the optimized plate-fin and pin-fin heat sinks are compared. Finally, a contour map, which depicts the ratio of the thermal resistances of the optimized plate-fin and pin-fin heat sinks as a function of dimensionless pumping power and dimensionless length, is presented. The contour map indicates that optimized pin-fin heat sinks possess lower thermal resistances than optimized plate-fin heat sinks when dimensionless pumping power is small and the dimensionless length of heat sinks is large. On the contrary, the optimized plate-fin heat sinks have smaller thermal resistances when dimensionless pumping power is large and the dimensionless length of heat sinks is small. |
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