| 酸性化学镀镍 |
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| 引用本文： | 程沪生.酸性化学镀镍[J].电镀与涂饰,2009,28(1). |
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| 作者姓名： | 程沪生 |
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| 作者单位： | 广州市广州大道北云涛花园7幢404室,广东 广州,510515 |
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| 摘 要： | 介绍了酸性化学镀镍工艺,给出了分散型和浓缩型化学镀镍液配方及工艺规范,分析了配方中各成分(包括主盐、还原刑、配位剂、稳定剂、光亮剂、加速刑和缓冲剂)的作用及工艺条件(包括温度和pH)对化学镀镍的影响.
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| 关 键 词： | 酸性化学镀镍 催化脱氢 工艺 配方 |
Acidic electroless nickel plating |
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| CHENG Hu-sheng.Acidic electroless nickel plating[J].Electroplating & Finishing,2009,28(1). |
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| Authors: | CHENG Hu-sheng |
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| Affiliation: | CHENG Hu-sheng Room 404,7th Block,Yuntao Garden,Tonghe Street,North of Guangzhou Road,Guangzhou 510515,China |
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| Abstract: | Acidic electroless nickel plating was introduced.The formulas and technical specifications of dispersion and concentration types of electroless nickel plating bath were given.The effects of bath components(such as main salt,reductant,complexant,stabilizer,brightener,accelerant and buffer) and process conditions(i.e.temperature and pH) on electroless nickel plating were analyzed. |
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| Keywords: | acidic electroless nickel plating catalytic dehydrogenation process formulation |
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