波峰焊工艺参数优化

波峰焊主要用于传统通孔插装印制电路板电装工艺以及表面组装与通孔插装元器件的混装工艺。与手工焊接相比较,波峰焊具有生产效率高、焊接质量好、可靠性高等优点。波峰焊接工艺是一个复杂而系统的工程,在实际生产过程中必须严格控制焊剂涂覆量、印制板预热温度、焊接温度和时间、印制板爬坡角度和波峰高度;综合调整其工艺参数,才能获得较好的焊接质量。

Optimized processing parameters of wave soldering

Wave soldering is mainly used in traditional through-hole cartridge PCB assembly process,as well as surface mount hole cartridge with oxidising components.Compared with manual welding,wave soldering welding with high efficiency,good quality and high reliability etc.As wave soldering process is a complicated system engineering,you should not only control such as coated weight of flux,preheating temperature and climbing angle of PCB,wave height,but also adjust processing parameters of wave soldering,in order ...