| 免清洗技术在印制板装联中的实用性和经济性及今后发展趋势 |
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| 引用本文： | 陈慧. 免清洗技术在印制板装联中的实用性和经济性及今后发展趋势[J]. 电子工艺技术, 1998, 19(5): 174-178 |
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| 作者姓名： | 陈慧 |
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| 作者单位： | 陕西省ＳＭＴ专委会 |
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| 摘 要： | 主要介绍了免清洗技术应用的现状及今后发展趋势。着重论述了中小企业如何大力开展免清洗工艺技术，并在重点考虑成本效益的同时，要积极配合国家环保局尽早实现逐步在２００６年淘汰ＯＤＳ物质的战略。此外，还谈到了免洗助焊剂使用注意事项。
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| 关 键 词： | ODS 免清洗 助焊剂 焊膏 印制板 |
Tendency Economy and Practicality of No-clean Technology in PCB Assembly |
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| Chen Hui. Tendency Economy and Practicality of No-clean Technology in PCB Assembly[J]. Electronics Process Technology, 1998, 19(5): 174-178 |
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| Authors: | Chen Hui |
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| Abstract: | Introduce the tendency and current,situation of no-clean technology use,Discuss how middle and small enterprise develop no-cleam technology.The enterprised should coordinate its activities with the central tasks of state environmetal protection bureau in order to achieve progressively climinating ODS before 2006 when they consider cost-effective.Lastly discuss Points for attention of using no-clean flux. No-clean technology is a effective way of replacing ODS. |
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| Keywords: | ODS Low solid no-clean flux/paste Process technology |
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