| 高密度封装技术现状及发展趋势 |
| |
| 引用本文： | 童志义.高密度封装技术现状及发展趋势[J].电子工业专用设备,2000,29(2):1-9. |
| |
| 作者姓名： | 童志义 |
| |
| 作者单位： | 信息产业部电子第四十五研究所,甘肃,平凉,744000 |
| |
| 摘 要： | 综述了对半导体集成电路发展有深刻影响的微电子封装技术的现状 ,指出了适用于高密度封装的载带封装 (TCP)、球栅阵列封装 (BGA)、倒装片 (FCT)、芯片规模封装 (CSP)、多芯片组件 (MCM)、三维封装等关键技术及其发展趋势
|
| 关 键 词： | 高密度封装 载带封装 球栅阵列封装 倒装片 芯片规模封装 多芯片组装 三维封装 现状 趋势 |
| 文章编号： | 1004-4507(2000)02-0001-09 |
| 修稿时间： | 2000-03-06 |
The Present Situation of High- Density Packaging and Its Future |
| |
| TONG Zhi-yi.The Present Situation of High- Density Packaging and Its Future[J].Equipment for Electronic Products Marufacturing,2000,29(2):1-9. |
| |
| Authors: | TONG Zhi-yi |
| |
| Affiliation: | TONG Zhi-yi
(The 45th Institute of Electronic, Ministry of II, Pingling Gansu 744000; China) |
| |
| Abstract: | The present situation of microelectronic packaging technology that have deeply influence on development of semiconductor IC is described.Also the key technologies such as TCP、BGA、FC、CSP、MCM、3D packaging etc.Which are used for high-density packaging and its future is pointed out. |
| |
| Keywords: | High?density packaging BGA FC CSP MCM 3D packaging The present situation The future |
| 本文献已被 CNKI 维普 万方数据 等数据库收录！ |
