导电聚苯胺薄膜上Bi2Te3合金层的电沉积及其热电性能

在导电聚苯胺薄膜上电沉积n型Bi-Te合金薄膜,采用循环伏安、XRD、EDS和SEM等手段分别对电化学沉积过程和产物的结构、形貌及组成等进行了表征,研究了聚苯胺绝缘化处理前后Bi_2Te_3沉积层热电性能的变化,以及沉积电位对其结构和性能的影响.结果表明:在180℃保温3 h可大大降低聚苯胺薄膜的导电性;阴极电位在-125 mV与-340 mV之间变化时,Bi-Te合金中的Te含量呈近似抛物线变化,且在-125 mV达到最大值67.76%;Te含量不同也相应地改变了沉积层的组织结构和热电性能;基体的导电性影响聚苯胺薄膜的热电参数测试值,通过热处理消除基体的影响后,热电薄膜的塞贝克系数和导电率的测量值分别提高了47.6μV/K和6.86×10~4s/m,功率因子从热处理前的1.6×10~(-4)W/K~2m提高到处理后的14.3×10~(-4)W/K~2m.

Electrodepostion and thermoelectric properties of Bi2Te3 films on the conducting polyaniline film electrode

Electrochemically deposited n–type Bi–Te alloy thin films were grown on the conducting polyaniline (cPANI) film electrode whose conducting property with heat treatment temperature was investigated. Cyclic voltammetry was used to determine the deposition voltage of Bi–Te; XRD, EDS and SEM were used for structural, morphological and compositional characterization; Thermoelectric transport properties of the electrodeposited Bi–Te thin films at different temperatures were measured before and after the heat treatment to cPANI; Influences of cathodic potential on the microstructures and thermoelectric properties of the as deposited film were also investigated. The results reveal that cPANI can be almost insulated after heat treated at 180 % for 3 h; Deposited Te content reached a maximum of 67.76% when –125 mV was applied and the structures and thermoelectric properties vary; The conductance of the substrate interferes the properties of the as deposited film. The Seebeck coefficient, electric conductivity and power factor of the as deposited film increased by 47.6 μV/K, 6.86×10⁴s/m and 14.3×10⁻⁴W/K²m, respectively when the cPANI is insulative.