热循环加载条件下焊点形态参数对板级光互连模块对准偏移影响分析

建立光互连模块有限元分析模型并进行热循环加载有限元分析,获取了垂直腔面发射激光器(Vertical Cavity Surface Emitting Laser,VCSEL)与耦合元件间的位置偏移;采用正交实验设计法设计了不同焊点结构参数组合并建立有限元模型,计算相应焊点形态参数组合下的位置偏移数据并进行方差分析.结果表明:在一个热循环周期内低温保温结束时刻位置偏移最大;外端光通道的位置偏移比中间光通道的偏移值大;在置信度为95%时VCSEL焊点高度对对准偏移具有显著影响,因素显著性排序由大到小依次为:VCSEL焊点高度、陶瓷基板焊点高度、VCSEL焊点体积和陶瓷基板焊点体积;单因子变量分析表明,位置偏移随VCSEL焊点高度增加而增大.

Effects of Solder Shape Parameters on Optical Interconnection Alignment Offset Under Thermal Cycling Load

A finite element model of optical interconnect module was established.The position offset between VCSEL(Vertical Cavity Surface Emitting Laser)and coupling element was obtained after finite elements analysis under thermal cycling load.Different solder shape parameter combinations were designed through orthogonal experimental design and used to establish finite element model.The range analysis was performed based on the alignment offsets of corresponding solder shape parameters.The results show that the maximum alignment offset takes place when the low temperature procedure ends in a thermal cyclic period, the alignment offset in the outer optical channel is greater than that in the middle optical channel;at the confidence of 95%, the height of the VCSEL solder joint has significent effect on the alignment offset, the level of which is sorted descendingly as the height of VCSEL solder joint, the height of ceramic substrate solder joint, the volume of VCSEL solder joint, and the volume of ceramic substrate solder joint, respectively.Single factor analysis results show that the alignment offset increases with the VCSEL solder joint height increasing.