| SOP集成电路塑料封装模具 |
| |
| 引用本文： | 李名尧,李霞,王元彪. SOP集成电路塑料封装模具[J]. 半导体技术, 2005, 30(6): 45-48 |
| |
| 作者姓名： | 李名尧 李霞 王元彪 |
| |
| 作者单位： | 上海工程技术大学材料工程系,上海,200336;上海柏斯高模具有限公司,上海,200062 |
| |
| 基金项目： | 科技部科技型中小企业技术创新项目 |
| |
| 摘 要： | 介绍了SOP集成电路塑料封装模具设计中温度补偿的计算方法和计算结果.封装模具包括上模、下模和附件三大部分,可分成浇注、成型、排气、顶出、复位、加热、温控、上料、预热、定位和支撑等功能系统.
|
| 关 键 词： | 集成电路 封装 模具 |
| 文章编号： | 1003-353X(2005)06-0045-04 |
| 修稿时间： | 2004-08-10 |
SOP Chip Packaging Mould |
| |
| Li Ming-yao,LI Xia,WANG Yuan-biao. SOP Chip Packaging Mould[J]. Semiconductor Technology, 2005, 30(6): 45-48 |
| |
| Authors: | Li Ming-yao LI Xia WANG Yuan-biao |
| |
| Abstract: | The calculation method and the result of the compensation of the temperature variety in packaging mould design are introduced. The packaging mould consists of three parts: upper half, lower half and accessories. It can be divided into injection, moulding, venting, ejecting, replacing, heating, temperature controlling, lead frame feeding, warm up, placing and supporting system ac- cording to the function. |
| |
| Keywords: | chip packaging mould |
| 本文献已被 CNKI 维普 万方数据 等数据库收录！ |
|
