| 热固性聚酰亚胺复合材料的制备及性能研究 |
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| 引用本文： | 王铎. 热固性聚酰亚胺复合材料的制备及性能研究[J]. 工程塑料应用, 2007, 35(5): 25-28 |
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| 作者姓名： | 王铎 |
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| 作者单位： | 陕西理工学院化学学院,汉中,723001 |
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| 摘 要： | 以均苯四甲酸二酐、二胺基二苯醚、N,N′-二甲基乙酰胺及纳米SiC为原料,经加热固化等工艺制备了热固性聚酰亚胺(PI)/纳米SiC复合材料。经测试,该复合材料的介电常数和吸水率均比纯PI明显降低,且复合材料中低分子纳米SiC均匀分散到PI内部,形成网络状杂化复合体系。
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| 关 键 词： | 热固性聚酰亚胺 纳米碳化硅 复合材料 介电常数 吸水率 |
| 修稿时间： | 2007-02-27 |
PREPARATION AND PROPERTY RESEARCH OF THERMOSETTING POLYIMIDE COMPOSITE |
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| Wang Duo. PREPARATION AND PROPERTY RESEARCH OF THERMOSETTING POLYIMIDE COMPOSITE[J]. Engineering Plastics Application, 2007, 35(5): 25-28 |
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| Authors: | Wang Duo |
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| Affiliation: | Institute of Chemistry, Shaanxi University of Technology, Hanzhong 723001, China |
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| Abstract: | Thermosetting polyimide composite is prepared by heat curing technology with PMDA,4,4'-ODA,N,N'-dimethyl acetamide and nanometer silicon carbide as raw material.The testing results show that the dielectric constant and water absorption of the composite are markedly lower than those of polyamide.The small molecular nanometer silicon carbide is dispersesed evenly inside polymide,and the network shape hybridization compound system is formed. |
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| Keywords: | thermosetting polyimide nanometer silicon carbide composite dielectric constant water absorption |
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