| 用于MEMS加工的双面深度光刻机对准系统设计 |
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| 引用本文： | 马平,唐小萍,杨春利.用于MEMS加工的双面深度光刻机对准系统设计[J].电子工业专用设备,2003,32(2):36-39,55. |
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| 作者姓名： | 马平 唐小萍 杨春利 |
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| 作者单位： | 中国科学院光电技术研究所,四川,成都,610209 |
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| 摘 要： | 比较了光刻机中几种常用的对准方式,并分析了其优缺点,在此基础上对双面深度光刻机底面对准系统的设计原理、结构及对准过程做了详细阐述,并进行了对准系统的精度分析,最后介绍了为系统实现所采取的其他技术措施。实践证明,该对准系统应用于深紫外双面深度光刻机中,系统运行稳定、可靠,完全能满足系统的精度要求。
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| 关 键 词： | MEMS 底面对准 对准精度 掩模 样片 |
| 文章编号： | 1004-4507(2003)02-0036-04 |
Design of Alignment System on Double-Faced and Deep-Exposure Alignerfor MEMS Machining |
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| Ma Ping,Tang Xiaoping,Yang Chunli.Design of Alignment System on Double-Faced and Deep-Exposure Alignerfor MEMS Machining[J].Equipment for Electronic Products Marufacturing,2003,32(2):36-39,55. |
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| Authors: | Ma Ping Tang Xiaoping Yang Chunli |
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| Abstract: | We compare several alignment fashions in common use on aligner,and analyze their relative merits.With this understanding,we expatiate on design principle、structure and align ment process of bottom side alignment(BSA)system on deep-exposure aligner,and analyze precision of alignment system.In the end,we introduce adoptive other measures for the system realiza tion.The system proves to function stably and reliably in practice when it applies to DUV dou ble-faced and deep-exposure aligner,and is able to meet system pre cision need completely. |
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| Keywords: | Micro electromechanical system Bottom side alignment Alignment precision Mask Silicon |
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