| 碳化硅颗粒增强铝基复合材料的热性能研究 |
| |
| 引用本文： | 王杏,田大垒,赵文卿. 碳化硅颗粒增强铝基复合材料的热性能研究[J]. 有色金属加工, 2007, 36(6): 23-25 |
| |
| 作者姓名： | 王杏 田大垒 赵文卿 |
| |
| 作者单位： | 河南理工大学材料科学与工程学院,河南焦作,454003 |
| |
| 摘 要： | 碳化硅颗粒增强铝基复合材料由于具有优异的机械性能和物理性能得到越来越广泛的应用，特别是热物理性能能够满足电子封装领域越来越高的要求，适应电子器件集成化程度不断提高的发展趋势。本文介绍和分析影响其导热性能、热膨胀系数及热稳定性的主要因素。
|
| 关 键 词： | 复合材料 碳化硅 导热性 热膨胀性 |
| 文章编号： | 1671-6795（2007）06-0023-03 |
| 收稿时间： | 2007-09-03 |
| 修稿时间： | 2007-09-03 |
Research on Thermal Properties of SiCp/Al Composite |
| |
| WANG Xing,TIAN Da-lei,ZHAO Wen-qing. Research on Thermal Properties of SiCp/Al Composite[J]. Nonferrous Metals Processing, 2007, 36(6): 23-25 |
| |
| Authors: | WANG Xing TIAN Da-lei ZHAO Wen-qing |
| |
| Abstract: | Silicon-carbide-particle-reinforced aluminum composite has been widely used because of its excellent mechanical properties and physical properties, in particular, thermal physical properties can not only meet the increasingly high requirements in electronic packaging, but adapt to the development trends which the electronic device integration degree enhances unceasingly. Silicon-carbide-particle-reinforced aluminum composite has a good heat dissipation performance, adjustable coefficient of thermal expansion and good thermal stability. In this paper, the factors and patterns affecting its thermal properties are introduced and analyzed. |
| |
| Keywords: | |
| 本文献已被 维普 万方数据 等数据库收录！ |
|
