| 3D打印技术解决未来空间运输问题的方案设想 |
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| 引用本文： | 李峰.3D打印技术解决未来空间运输问题的方案设想[J].战术导弹技术,2013(6):5-9. |
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| 作者姓名： | 李峰 |
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| 作者单位： | 北京海鹰科技情报研究所,北京100074 |
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| 摘 要： | 3D打印技术在工业生产各领域,尤其是在航空航天领域具有广泛的用途。通过专利研究了3D打印技术及其分支技术的发展等问题,重点分析了通过3D打印技术在月球建造基地、在空间站打印结构体、电路板、传感器等部件的可行性与在太空特殊环境下需注意的问题和解决方案。预测了3D打印技术在解决未来空间运输问题的发展方向。
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| 关 键 词： | 3D打印 空间运输 专利分析 |
The Solution of Future Space Transport by Three-dimensional Printing Technology |
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| Li Feng.The Solution of Future Space Transport by Three-dimensional Printing Technology[J].Tactical Missile Technology,2013(6):5-9. |
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| Authors: | Li Feng |
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| Affiliation: | Li Feng (Beijing HIWING Scientific and Technological Information Institute, Beijing 100074, China) |
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| Abstract: | Three-dimensional printing technology （3DP） has been applicated in wide range of industries, particularly in aerospace industries. In this article, the 3DP technology was studied through patent infor- mation. The distribution of 3DP technology was analyzed. The feasibility of building architectures on moon and such as manufacturing structures, electronic tracks, sensor, on space station by 3DP technolo- gy were discussed. The direction of 3DP technology development was discussed. |
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| Keywords: | three-dimensional printing space transport patent analysis |
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