| 浅谈CTE及其对FC—BGA焊点可靠性的影响 |
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| 引用本文： | 林佳,郑仰存,张亚平,杨智勤.浅谈CTE及其对FC—BGA焊点可靠性的影响[J].印制电路信息,2013(11):31-33. |
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| 作者姓名： | 林佳 郑仰存 张亚平 杨智勤 |
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| 作者单位： | 深南电路有限公司,广东深圳518117 |
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| 摘 要： | PCB对封装行业来说，最关键的莫过不同元器件和PCB之间的热膨胀系数（CTE）匹配性问题。其中FCRGA封装，通过倒装芯片实现芯片焊料凸点与FCBGA基板的直接连接，在FCBGA类产品中可实现较高的封装密度，获得更优良的电性能和热性能。但由于PCB与芯片之间cTE的不匹配，而导致FCBGA焊点的可靠性问题。本文就CTE影响FCBGA焊点可靠性展开讨论。
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| 关 键 词： | 热膨胀系数 印制电路板 倒装芯片球栅阵列 封装 焊点 |
Analysis of the CTE and its influence on FCBGA solder joint reliability |
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| LIN Jia,ZHEN Yang-cun,ZHANG Ya-ping,YANG Zhi-qin.Analysis of the CTE and its influence on FCBGA solder joint reliability[J].Printed Circuit Information,2013(11):31-33. |
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| Authors: | LIN Jia ZHEN Yang-cun ZHANG Ya-ping YANG Zhi-qin |
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| Affiliation: | LIN Jia ZHEN Yang-cun ZHANG Ya-ping YANG Zhi-qin |
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| Abstract: | To the encapsulation industry, the key and troublesome part is the control of match of PCB and die. The FCBGA encapsulation, which connect the die and signal line with the solder joint, will reach the high density and reliability, gain perfect electronic connection and heat conduction. But considering the mismatch of PCB and die, the reflow process of the packing will lead to the reliability of the solder joint. The article is mainly about the analysis of the influence of CTE to the FCBGA solder joint reliability. |
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| Keywords: | CTE PCB FCBGA Packing Solder joint Reliability |
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