Influences of temperature and contact pressure on thermal contact resistance at interfaces at cryogenic temperatures |
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| Authors: | Dongmei Bi Huanxin Chen |
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| Affiliation: | 1. The University of Newcastle, School of Engineering, Callaghan, NSW 2287, Australia;2. Department of Mechanical Engineering, Faculty of Engineering, University of Malaya, Malaysia;3. School of Mechanical and Mining Engineering, The University of Queensland, Qld 4072, Australia;1. Thermo Fluids Systems University Technology Centre, Faculty of Engineering and Physical Sciences, University of Surrey, Guildford, Surrey GU2 7XH, UK;2. Department of Combustion Engineering, Rolls Royce, Derby, Derbyshire DE24 8BJ, UK;1. School of Energy and Power Engineering, Nanjing University of Science & Technology, China;2. College of Energy and Power Engineering, Nanjing University of Aeronautics & Astronautics, China |
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| Abstract: | The microscopic heat transfer between solid and solid at cryogenic temperatures exists in many application fields. This paper employed the Laser Photothermal Method (LPM) which is a transient and non-contact method to measure the Thermal Contact Resistance (TCR) between solid and solid in the temperature range of 70–290 K and the pressure range of 0.2–0.7 MPa. This paper analyzed the effects of the temperature and the contact pressure on the TCR at interfaces. The relationship between the TCR and the temperature at certain contact pressure was established, and the explanation about this phenomenon was given. Following, the TCR of SS 304–AlN, SS 304–Cu and SS 304–SS 304 were compared at different temperatures and contact pressures. |
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