Development and testing of an innovative two-arm focal-plane thermal strap (TAFTS) |
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Authors: | E. Urquiza C. Vasquez J. Rodriguez B. Van Gorp |
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Affiliation: | 1. Jiujiang Key Laboratory of Green Remanufacturing, 332005 Jiujiang, China;2. School of Mechanical & Materials Engineering, Jiujiang University, 332005 Jiujiang, China;1. State Key Laboratory of Gansu Advanced Non-ferrous Metal Materials, Lanzhou University of Technology, Lanzhou 730050, PR China;2. Key Laboratory of Automobile Materials, Department of Materials Science and Engineering, Jilin University, Changchun 130025, PR China;3. College of Technology and Engineering, Lanzhou University of Technology, Lanzhou 730050, PR China;1. LRC CEA-IRTES-LERMPS-UTBM, site de Montbéliard, 90010 Belfort cedex, France;2. DEN/DANS/DPC/SEARS/LISL CEA Saclay, 91191 Gif-sur-Yvette, France;3. IRTES-LERMPS-UTBM, site de Montbéliard, 90010 Belfort cedex, France;4. Institut Charles Delaunay, Laboratoire des Systèmes Mécaniques et d''Ingénierie Simultanée — UTT, Antenne de Nogent-52, Pôle Technologique de Haute-Champagne, 52800 Nogent, France;5. CEA Cross-Cutting program on Advanced Materials Saclay, 91191 Gif-sur-Yvette, France |
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Abstract: | Temperature control of optical focal planes comes with the intrinsic challenge of creating a pathway that is both extremely flexible mechanically and highly conductive thermally. The task is further complicated because science-caliber optical focal planes are extremely delicate, yet time, cost, and their unique nature means that their mechanical resiliency is rarely tested and documented. The mechanical engineer tasked with the thermo-mechanical design must then create a highly conductive thermal link that minimizes the tensile and shear stresses transmitted to the focal plane without design parameters on an acceptable stiffness and without data on the stiffness of previously implemented thermal links.This paper describes the development and testing of the thermal link developed for the Portable Remote Imaging Spectrometer (PRISM) instrument. It will provide experimentally determined mechanical stiffness plots in the three axes of interest. Analytical and experimental thermal conductance results for the two-arm focal-plane thermal strap (TAFTS), from cryogenic to room temperatures, are also presented. The paper also briefly describes some elements of the fabrication process followed in developing a novel design solution, which provides high conductance and symmetrical mechanical loading, while providing enhanced flexibility in all three dimensions. |
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