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Material design of a film cooling system using experimental heat transfer data
Authors:Kyung Min Kim  Jiwoon Song  Jun Su Park  Sanghoon Lee  Hyung Hee Cho
Affiliation:1. Korea District Heating Corporation, 781 Yangjae-daero, Gangnam-gu, Seoul 135-220, Republic of Korea;2. Yonsei University, 50 Yonsei-ro, Seodaemun-gu, Seoul 120-749, Republic of Korea
Abstract:The present study numerically calculates the temperature and thermal stress distributions near a normal cooling hole. We evaluate the effects of material properties on thermal damage by using local heat transfer data from previous experiments. The experimental results are converted into the surface’s heat transfer coefficients and the adiabatic wall temperature while using surface boundary conditions. The calculated results reveal that the thermal stresses depend on the main stream temperature and the material properties. To predict the maximum thermal stress near the normal cooling hole, we provide a single correlation consisting of the material properties and the main stream temperature.
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