Through-silicon-chip transmission lines |
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| Authors: | Ng KT Boellaard E Pham NP Burghartz JN |
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| Affiliation: | Delft Inst. of Microelectron. & Submicron Technol., Delft Univ. of Technol.; |
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| Abstract: | Through-chip transmission lines connecting the frontside and backside of high-resistivity wafers are fabricated using bulk-micromachining and backside metal patterning. Experimental results illustrate the feasibility of low-loss through-chip microstrips and coplanar waveguides for innovative integration concepts of radio-frequency and microwave systems in silicon technology |
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