| 300mm晶圆对半导体设备的挑战 |
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| 引用本文： | 翁寿松. 300mm晶圆对半导体设备的挑战[J]. 电子工业专用设备, 2003, 32(2): 11-14 |
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| 作者姓名： | 翁寿松 |
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| 作者单位： | 无锡市罗特电子有限公司,江苏,无锡,214002 |
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| 摘 要： | 300mm晶圆生产线必须采用新标准、新技术、新流程、新设备、新布局、新厂房和新设施等。因此,300mm晶圆向半导体设备提出了挑战。
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| 关 键 词： | 300mm 晶圆 生产线 新技术 新设备 |
| 文章编号： | 1004-4507(2003)02-0011-04 |
| 修稿时间： | 2003-01-12 |
The Challenge of Semiconductor Equipment from the 300 mm Wafer |
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| WENG Shou-song. The Challenge of Semiconductor Equipment from the 300 mm Wafer[J]. Equipment for Electronic Products Marufacturing, 2003, 32(2): 11-14 |
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| Authors: | WENG Shou-song |
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| Abstract: | The300mm wafer production line must adopts new standard,new technology,new tach-nological process,new equipment,new layout,new workshop and new installation.The300mm wafer challenges to the semiconductor equipment. |
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| Keywords: | mm wafer Production line New technology New equipment |
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